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mobile phone laptop repair bga rework station A5

mobile phone laptop repair bga rework station A5

Shenzhen Dinghua Technology Development Co., LTD.

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Uploaded on 1 year ago

1. Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.
2. Chip auto feeding system enabled.
3. HD CCD Optical Alignment for precisely mounting BGA. CCD lens auto Folding & streching.
4. CCD with split vision, two-color separation, and autofocus functions.
5. Panasonic Servo Driver, top head and CCD movements are quiet, stable and accurate.
6. Indepdent PLC control. Laser Positioning for Fast Positioning BGA Chip and motherboard.
7. Most advanced inner software, dedicated for next generation precision chip level repairing.
8. Login mode enabled. Admin mode, engineer mode, operator mode. Avoid miss or wrong operation.
9. Widely used in motherboard chip level repairing, can rework BGA, PGA, POP, CPGA, PBGA, QFN, TQFP etc

Specifications
1 Total Power 6800w
2 Three independent heaters Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 4200w
3 Voltage AC220V±10% 50/60Hz
4 Electric parts 7'' touch screen + temp control module + Panasonic Servo Driver + PLC + LCD
display + optical CCD system + laser positioning + industrial joystick + industrial PC
5 Additional function CCD lens with chip feeding plate, chip auto feeding system enabled.
6 Temperature control K-Sensor closed-loop + PID automatic temp compensation + temp module
7 PCB positioning V-groove + universal fixture + movable PCB shelf
8 Applicable PCB size Max 420x450mm Min 22x22mm
9 Applicable BGA size 2x2mm~80x80mm
10 Machine Dimension 600x700x850mm (L*W*H)
11 Net/Gross Weight 91/160 Kg