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On ECPlaza since 2005
Korean Supplier
Location:

Seoul, Korea

Main Item: IC assembly service provider, Semiconductor packaging service provider
Business Type: Manufacturer, Exporter, Importer, Agent, Distributor, Service
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VFBGA /Tape substrate-Very Thin Fine Pitch BGA (CSP)

 
 

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Flex, Film BGA / Flexible Tape substrate- BGA with individual mold

 
 

PBGA/Plastic molded Ball Grid Array Body Size : - Smallest : 13mmx13mm, - Largest : 40x40mm Ball Count : 119~1156 Ball Pitch : 1.0/1.27/1.5mm Solder Ball : Sn63/Pb37,Sn95.5/Ag4.0/Cu0.5, Sn96.5/Ag3.0/Cu0.5

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S K Kang ( STANDARD SYSTEMS )
(20~4000 Characters)
Listed on Nov 18, 2009
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