Product Description



Equipped with the high-speed 3D imager heliSense™ S3, this brand new measurement module combines sub-micrometer surface metrology with large field of views. The H4 operates as a non-contact white light interferometer on almost any surface, including glass and metal. 



The H4 is engineered for in-line applications requiring high throughput and robustness. Customized modules are available for equipment manufacturers.



As all Heliotis products, the module is manufactured in Switzerland for long lasting reliability.



The instrument utilizes Heliotis' proven parallel Optical Coherence Tomography principle and offers unmatched scan rates. Fast acquisition rates and a special design of the interferometer render vibration isolation obsolete.

Product Specification / Models

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Applications



Providing fast and robust 3D-metrological data, Heliotis' unique technology is capable of bringing innovations to many different fields - limited only by your imagination.



To explore what our technology can do for you, please send us a short description of your measurement task. We will gladly perform test measurements of your samples free of charge.



 



Electronics, Technical Surfaces















CSPs and micro-BGAs continue to increase the packaging density of PCBs, but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration, monitor process statistics for SPC and increase First Pass Yield.



Likewise, the requirement on technical surfaces typically increases with miniaturization as surfaces roughness become more significant and tolerances smaller. True 3D-inspection yields unambiguous quality data and can pr

Heliotis helilnspect H4

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