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Semiconductors

ESEC 2007

Die bonder is the key equipment of Semiconductor back-end encapsulation processing. Die bonder:Achieve the die pickup from wafer automatic,and then put it on the pad. Wire boder:To connect the welding spot of die and welding spot of pad. ESEC 2007
China
Main Item automation equipment
Business Type Manufacturer

ESEC 2005

Die bonder is the key equipment of Semiconductor back-end encapsulation processing. Die bonder:Achieve the die pickup from wafer automatic,and then put it on the pad. Wire bonder:To connect the welding spot of die and welding spot of pad....
China
Main Item automation equipment
Business Type Manufacturer