Thermal Conductive Gel Pad: DT44 5G mmWave
Dec 25, 2020
LiPOLY DT44 is a soft thermally conductive gel pad specifically designed for networking applications. DT44 is designed to focus on Dk and Df to reduce interference in RF modules. DT44 has a thermal conductivity of 3.0 W/m*K. This product can be...
Thermal Interface Material, Thermal Pad, Thermal Gap Filler