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Aluminum-based Copper-clad Laminate

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Company: Bizark CO., LTD
Membership: Free Member since Aug 02, 2011
Country/Region: ChinaChina
Address: Building 31, Jishan Software Park, No.1 Jishan Avenue, Jiangning District, NanJing, NanJing, Jiangsu, China 211153
Contact: Ms. Jenna Wang
Phone: 86-025-5239-5231
Fax: 86-025-5239-5153
Tags: copper clad laminate
Online Postings: More 1000 Trade Leads , Product Catalog(s)
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Description: Aluminum-base copper clad laminate products consist of aluminum-base, thermal conductivity resin on the Al base surface, single size copper foil, and after hot-pressing process formed. CCAF-01 Al-based Copper-clad Laminate Aluminum-based copper-clad laminate has excellent flame retardant ability, high mechanical strength, dimensional stability, etc. Especially, it has very good heat sink, electromagnetic shielding and solder float. It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system, etc. Note: Chaoshun specially produces Metal-base Copper-clad laminates and our products have been compiled series with complete specifications. The type and specification of Aluminum-based laminates: CCAF-01, CCAF-01-R, CCAF-04-A, CCAF-05, CCAF-06, etc; 0.8mm,1.0mm,1.5mm,2.0mm,3.0mm, etc. Thickness of the copper: 18um, 35um, 70um, 105um, 140um Base Size: 330mm×380mm (13"×15"), 500mm×600mm (20"×24"), 380mm×660mm (15"×26"), 1200mm×500mm (47.3"×20"), 1200mm×600mm (47.3"×24") Test Board: CCAF-01 CCL Thickness of copper: 35μm Thickness of Al-base: 1.5mm Test Report: Serial Number Test Item Unit Test Report 1 Peel Strength A N/mm 2.0 After Thermal Stress (260℃) N/mm 1.8 2 Blister Test After Thermal Stress / (260℃, 2min) No Stratified, No Bubble 3 Thermal resistance ℃/W 1.0 4 Thermal-conductive Factor W/m·k 1.0 5 Flammability (A) / FV-0 6 Surface Resistivity A MΩ 5×107 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 2×106 7 Volume Resistivity A MΩ 4×108 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 5×107 8 Dielectric Breakdown AC (Leakage Current 5mA) KV 4 9 Dielectric Constant (1MHZ) (40℃, 93%, 96h) / 4.2 10 Dielectric Loss (1MHZ) (40℃, 93%, 96h) / 0.02 11 CTI V 230 12 Operating Voltage (AC) V 120 CCAF-01-R Al-based Copper-clad Laminate Test Board: CCAF-01-R CCL Thickness of copper: 35μm Thickness of Al-base: 1.5mm Test Report: Serial Number Test Item Unit Test Report 1 Peel Strength A N/mm 2.0 After Thermal Stress (260℃) N/mm 1.8 2 Blister Test After Thermal Stress / (260℃, 2min) No Stratified, No Bubble 3 Thermal Resistance ℃/W 1.0 4 Thermal-conductive Factor W/m·k 1.0 5 Flammability (A) / FV-0 6 Surface Resistivity A MΩ 5×107 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 2×106 7 Volume Resistivity A MΩ 4×108 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 5×107 8 Dielectric Breakdown AC (Leakage Current 5Ma) KV 6 9 Dielectric Constant (1MHZ) (40℃, 93%, 96h) / 4.2 10 Dielectric Loss (1MHZ) (40℃, 93%, 96h) / 0.02 11 CTI V 230 12 Operating Voltage (AC) V 960 CCAF-04-A Al-based Copper-clad Laminate Test Board: CCAF-04-A CCL Thickness of copper: 35μm Thickness of Al-base: 1.5mm Test Report: Serial Number Test Item Unit Test Report 1 Peel Strength A N/mm 1.05 After Thermal Stress (260℃) N/mm 1.05 2 Blister Test After Thermal Stress / (288℃, 2min) No Stratified, No Bubble 3 Thermal Resistance ℃/W 0.65 4 Thermal-conductive Factor W/m·k 1.5 5 Flammability (A) / FV-0 6 Surface Resistivity A MΩ 5×107 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 4.5×106 7 Volume Resistivity A MΩ 1.0×108 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 1.9×107 8 Dielectric Breakdown AC (Leakage Current 5Ma) KV 4 9 Dielectric Constant (1MHZ) (40℃, 93%, 96h) / 4.2 10 Dielectric Loss (1MHZ) (40℃, 93%, 96h) / 0.029 11 CTI V 600 12 Operating Voltage (AC) V 500 CCAF-05 Al-based Copper-clad Laminate Test Board: CCAF-05 CCL Thickness of copper: 35μm Thickness of Al-base: 1.5mm Test Report: Serial Number Test Item Unit Test Report 1 Peel Strength A N/mm 1.08 After Thermal Stress (260℃) N/mm 1.05 2 Blister Test After Thermal Stress / (288℃, 2min) No Stratified, No Bubble 3 Thermal Resistance ℃/W 0.45 4 Thermal-conductive Factor W/m·k 2.2 5 Flammability (A) / FV-0 6 Surface Resistivity A MΩ 3.68×107 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 3.39×106 7 Volume Resistivity A MΩ 4.2×108 Constant Humidity Treatment (25℃~65℃, RH: 90%~98%, 20 Cycle) 3.17×107 8 Dielectric Breakdown AC (Leakage Current 5Ma) KV 6 9 Dielectric Constant (1MHZ) (40℃, 93%, 96h) / 4.24 10 Dielectric Loss (1MHZ) (40℃, 93%, 96h) / 0.03 11 CTI V 600 12 Operating V
Contact Information
Ms. Jenna Wang
 
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Company : Bizark CO., LTD
Address : Building 31, Jishan Software Park, No.1 Jishan Avenue, Jiangning District, NanJing, NanJing, Jiangsu, China
Zip/Postal : 211153
Telephone : 86-025-5239-5231
Fax : 86-025-5239-5153