Sputtering Plate
Purity: 98%, 99%, 99.5%, 99.9%, 99.95%, 99.99%, 99.999% 1.) Oxide sputtering target: La2O3, CeO2, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb4O7, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3, Lu2O3, Sc2O3, Y2O3, Ta2O5, Nb2O5, Ga2O3, V2O5, ZrO2 doped with Ti, WO3, HfO2, MgO, ...